Components for Mobile Phone
General Lighting Warm White Power Led
Automotive Electronic Controls
Silicon wafer with processors
Television and Cabinet
ABOUT SHINWA DISPENSING & MECHATRONICS
Helping Industry Leaders Enable New Product Designs and Innovations
Founded in 1951, Shinwa Co. Ltd is a publicly traded company listed on the Tokyo Stock Exchange with headquarters in Nagoya, Japan. Shinwa has advanced engineering expertise in Precision Dispensing and Metal Joining technologies such as soldering, welding and brazing. The company has 600+ employees and operates in over 30 countries throughout the world.
Formed in 2005, the Dispensing & Mechatronics Division designs and builds precision dispensing machines for Solder Paste Jetting, SmartPhone Display Bonding and small dosing applications common in today's micro-electronic industry. Whether your needs are solder paste jetting, precision bonding, underfill, encapsulation, sealing, etc., Shinwa equipment meets today's miniaturization trends and the need for more precise, intelligent system solutions. Our equipment is used every day by companies in Mobile Electronics, SmartPhone Assembly, Opto-electronics, LED Lighting, MEMS, Sensors, HDD and Semiconductor Packaging industries.
Shinwa supports a culture of innovation by embracing a motto we call the “Three Pioneering Spirits." Pioneering innovation to meet the needs of new products, new customers and new manufacturing requirements.
Shinwa offers enabling technology solutions in several areas:
Solder paste jetting systems offer advancements in component joining for 01005 capacitors and resistors, Chip Scale Packages (CSP) and RF Shields
Nano-liter and Pico-liter dispensing of bonding adhesives meets next generation packaging requirements for Opto-electronics, Sensors, HDD, MEMS and Acoustic devices
MsL 23 multiple head machine provides higher UPH for Semiconductor Packaging and PCB Assembly
Position Synchronized Jetting results in greater precision and higher production performance for Solder Paste Jetting, SmartPhone Case to Display bonding and Wafer level underfill
Automatic Line Tracking System detects part tolerances and compensates with precision bead and line placement for SmartPhone Display to Case Bonding